As the cleanroom is classified only with ISO Class 5 to 7, the level of contamination is controlled accordingly. Besides, for academic purposes, the more important matter to be considered is the core process of the fabrication of IC. The tools for cleanliness maintenance would be the basically the sticky floor mat to grab particulates from the shoes. And there is a pass-through door connecting to two rooms which has a interlocking features. Beside that, personnel are restricted to wear the contamination protection garment. There are air filter incorporated with the ceilings or walls inside the cleanroom.

The cleanroom in the university consist of four rooms. They are the room for lithography, etching, IC testing and characterisation and the gowning room. The function of these rooms will be discussed in more detail when it come to the process of fabrication.

In the industry, the cleanroom is classified mostly in ISO Class10 and some are ISO Class 1. Class 10 means that

Repeat the process of oxidation as in first step. The wafer is placed back into the furnace 2hrs at 1000c.

Silicon dioxide layer is produced on the surface of the wafer. It is a insulating layer which is grown by heating in an oxygen rich furnace at temperature of 1000c for four hours. This is known as 'wet oxidation'. In the University, there about four to five furnaces in the etch room which can accommodates an average of 3.0 inches oxide wafers. Students are bound to observe as the process is in operation. Everything is done manually. Things are pretty much different in the industry that involved in mass production where most of the things are pretty many automatics. Wafers with diameter doubled that one used in the University and they are an epitaxial-layered wafers.

Some topics in this essay:
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