Before getting into what Chemical Vapor Deposition is we much first learn what deposition is. Deposition is a physical change in an element. When I say physical change I mean like evaporation when a material goes from liquid to gas state. Or freezing is when a material goes from liquid to solid state. Deposition is like sublimanation where instead of

Here is a picture of what some Chemical Vapor Deposition reactor look like.

Generally there are two types of Deposition. There is Physical Vapor Deposition and there is Chemical Vapor Deposition. In Physical Vapor Deposition they use a couple different techniques like; vacuum evaporation, sputtering and molecular beam epitaxy (MBE). In Chemical Vapor Deposition there are a couple different techniques as well, including; atmospheric pressure chemical vapor deposition (APCVD), low-pressure chemical vapor deposition (LPCVD), plasma assisted (enhanced) chemical vapor deposition (PACVD, PECVD), photochemical vapor deposition (PCVD), laser chemical vapor deposition (LCVD), metal-organic chemical vapor deposition (MOCVD), chemical beam epitaxy (CBE) and chemical vapor infiltration (CVI). Although these are all different types of chemical vapor deposition they all use the same basic formula to create the same basic product. But don’t think that these are the only ways that this can be done. There is also other film growing techniques. These are a bite different in the sense that they take chemicals from the liquid state to the solid state. These include spray coating; spin coating, electroplating and liquid phase epitaxy.

The products that we are left with from chemical vapor deposition are usually solid products that take the shape of thin films or powders. There materials can be alloys, metals, ceramics, or polymeric materials. With such a wide variety of materials there is a wide use for these materials.

There are also a lot of common precursors that we need to worry about. Those include; Hydrides: MH, SiH 4, GeH 4, AlH 3(NMe 3) 2, NH 3, PH 3, halides: MX, TiCl 4, TaCl 5, MoF 6, WF 6, metal-organics - metal alkyls: AlMe 3, AliBu 3, Ti(CH 2tBu), metal alkoxides: Ti(OiPr) 4, [Cu(OtBu)], metal dialkylamides: Ti(NMe 2)4, Cr(NEt 2), metal diketonates: Cu(acac) 2, Pt(hfac), metal carbonyls: Fe(CO) 5, Ni(CO) 4.

Now that we know what we need to keep in mind we can start making the system. When making the system we need to have gas and vapor delivery systems to get the molecules to the directed source, which is the reactor. Now that we have the gas in the reactor we need to consider the hot and cold walls of the reactor. When selecting the hot wall we need to make sure it can withstand high heat and high pressure. With the cold wall we need to make sure it can dissipate heat at a reasonable amount of time. Now we need to think about the geometry of the construction. Someth

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